Chip Manufacturing

Front-End Defect Inspection

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Wafer Edge Inspection and Metrology Systems
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Product Description

The VisEdge CV300R and CV300R-EP wafer edge inspection and metrology systems utilize innovative technology to meet edge-defect inspection and edge metrology requirements for development and volume production of wafers and ICs. The VisEdge CV300R-EP also features edge profile metrology, to ensure in-spec edge geometry and surface integrity of incoming wafers.
 
  • Unique, multi-channel optical design leverages simultaneous brightfield, darkfield and phase-contrast modes to capture a broad range of macro and micro edge defect types with industry-leading sensitivity
  • Rules-based defect classification algorithms operate on multi-channel data to minimize edge background noise and achieve high defect classification accuracy and purity
  • On-board, high resolution microscope enables review of individual edge defects for quick disposition
  • Unique phase channel and continuous-scan design enable one-pass measurement of the complete EBR film stack, allowing accurate characterization of coverage, concentricity and uniformity of the edges
  • Simultaneous edge defect inspection and multi-layer edge metrology in the near-edge and top bevel regions of the wafer now include data from patterned areas, to provide greater coverage and more accurate determination of the film edge
  • Calibrated edge profile measurements of all sixteen SEMI standard parameters facilitate bare wafer incoming quality control at fabs (VisEdge CV300R-EP only)
  • Edge profile feedback to the metrology algorithm enables accurate measurement of film stack height (“z-cut”) in the bevel (VisEdge CV300R-EP only)
  • Enhanced performance on low-contrast films and the ability to detect buried edges in dielectric films broaden the capability of the VisEdge platform
  • Rotating optical head eliminates “blind spots” and “stitching” errors in edge images and subsequent data analysis
  • Stand-alone design, dedicated to wafer edge inspection and metrology, enables highest-resolution data collection from all zones comprising the wafer’s edge: top and bottom near-edge; top and bottom bevel; and apex

Applications

Immersion Lithography: Mechanical coupling of the scanner head to the wafer surface through the immersion fluid drives new, stringent specifications for the edges of the lithography film stack. VisEdge defect data helps engineers ramp immersion processes and monitor costly cross-contamination issues in production.

Edge Bead Removal: VisEdge’s EBR metrology application characterizes nonuniform edges and identifies overlapping films—key measurements as die real estate concerns shrink the total width of the boundary of the film stack and push it into the side bevel. Improved edge uniformity correlates with lower defect counts generated during immersion lithography.

Film Concentricity Monitoring: Monitor concentricity of films on top, bevel and backside of the wafer to maintain edge exclusion uniformity and lower risk of arcing and other defects related to film edge position.

Deposition, Etch and CMP: VisEdge wafer defect inspection system detects film delamination and flaking created by deposition over residues. These defects generate particles that can migrate to the patterned area of the wafer and affect yield.

Bevel Etch and Clean: Engineers can use VisEdge systems to optimize and monitor the effectiveness of the bevel removal process in both development and production by monitoring defectivity pre-and post-processing.

Wafer Manufacturing OQC and IC Fab IQC: VisEdge monitors for defects such as particles, scratches, mechanical damage, chipping and cracking, and the VisEdge CV300R-EP model also characterizes the edge profile.

 

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